Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’
Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’
At an Architecture Day event hosted this week, Intel articulated an unusually lucid strategy for its development of future processors, most of which will revolve around fragmenting the various elements of a modern CPU into individual, stackable "chiplets."
December 12, 2018 at 04:14AM
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